Micron-Level SMT Assembly
High-velocity printed circuit board manufacturing engineered for zero-defect performance in aerospace, automotive, and industrial hardware applications. We bridge the gap between complex engineering and physical scale.
Hardware Execution Specs
Our automated SMT production lines are calibrated for high-density interconnects and complex multi-layer substrates, maintaining strict dimensional control across every production run.
Component Placement
Substrate Capabilities
Placement Accuracy
Ultra-fine pitch micro-BGA assembly down to 0.3mm pitch with automated optical alignment and continuous coplanarity monitoring.
Rigid, flex, and rigid-flex multilayer routing with controlled impedance, blind and buried vias, and high-frequency RF laminates.
High-speed chip shooters and multi-function placement heads deliver repeatable micron-level accuracy across high-velocity production runs.
Every solder joint is subjected to automated optical inspection and environmental stress screening before shipment.
We eliminate field failures through 100% 3D solder paste inspection, flying probe testing, and continuous thermal cycling.
Cleanroom System Integration
Our Class 10,000 cleanroom environments protect sensitive electro-optical assemblies and medical-grade hardware from particulate contamination during final box-build enclosure.
From sub-assembly calibration to final functional testing, our integrated lines ensure that your complete physical product is delivered fully validated.
Initiate Technical Review
Submit your Gerber files and bill of materials for a comprehensive manufacturing capability assessment conducted by our senior engineering team.